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2025/11/25 News Release

Regarding Certain Reports on the Electrolytic Copper Foil "VSP™" for High-Frequency Substrates in Taiwan

Today, there have been some unverified reports within Taiwan claiming that Mitsui Kinzoku’s electrolytic copper foil "VSP™" for high-frequency substrates has encountered significant quality issues and has been removed from the supply chains of major customers. However, these claims are unfounded and there is no such fact.

As announced in our news release dated November 11, 2025, titled "VSP™ Electro-Deposited Copper Foil for High-Frequency Circuit Boards Production Capacity Enhanced", our plan to gradually increase production capacity to 1,200 tons per month by September 2028, remains unchanged. Based on stable quality, Mitsui Kinzoku will continue its efforts to additionally increase production capacity to meet the continued growth of demand in the future.

Mitsui Kinzoku will contribute to the realization of a sustainable society by implementing its vision for 2030, “Building new businesses -and the future- with our material intelligence,” based on its purpose, “We promote the well-being of the world through a spirit of exploration and diverse technologies.”

Please check the below PDF file for details.
Regarding Certain Reports on the Electrolytic Copper Foil "VSP™" for High-Frequency Substrates in Taiwan

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