Mitsui Kinzoku Company, Limited (President: Seiji Ikenobu; “Mitsui Kinzoku”) announces that Cuprima™, its copper sinter material developed and being commercialized by the AST (Advanced Sinter Technology) Business Development Unit within the Business Creation Sector, has been selected for its first mass-production application as a bonding material for next-generation electric vehicle (EV) power modules.
As power modules, particularly those used in EVs, continue to achieve higher power density and efficiency, demand is growing for bonding materials that offer both high thermal conductivity and long-term reliability.
Mitsui Kinzoku’s proprietary material design and paste formulation technologies enable Cuprima™ to leverage the inherent advantages of copper and provide excellent heat dissipation and long-term reliability.
This first mass-production application of Cuprima™ represents an important milestone in the full-scale commercial development of the business. Evaluations are currently progressing with more than thirty power semiconductor manufacturers globally, and some customers are conducting evaluations with the aim of adopting Cuprima™ for mass production during fiscal 2026.
Building on this first mass-production adoption, Mitsui Kinzoku will accelerate the global expansion of Cuprima™, contribute to the advancement of electrification, and pursue further growth in its copper sinter material business.
Mitsui Kinzoku will contribute to the realization of a sustainable society by implementing its vision for 2030, “Building new businesses—and the future—with our material intelligence,” based on its purpose, “We promote the well-being of the world through a spirit of exploration and diverse technologies.”
Please check the below PDF file for details.
Cuprima™ Copper Sinter Material Marks First Mass-Production Adoption