Mitsui Kinzoku Company, Limited (President: Seiji Ikenobu; “Mitsui Kinzoku”) announces that it will accelerate its plan to bolster its MicroThin™ production capacity by FY2030, which it announced in the
Enhanced Production Capacity for MicroThin™ news release dated August 7, 2026. In the previous news release, Mitsui Kinzoku announced that it would achieve production capacity of 6 million m2 per month in FY2028. Now, the plan is to increase monthly production to 5.2 million m2 in the second half of FY2026, to 5.6 million m2 in FY2027, and then to 6.2 million m2 in FY2028. MicroThin™ is manufactured at its Ageo Plant and Malaysia Plant (Mitsui Copper Foil (Malaysia) Sdn. Bhd). The plan has been accelerated by bringing forward the plan to enhance productivity and install some equipment at the Ageo Plant, and it involves without major additional capital investments.
Demand for semiconductor package substrates used in data centers and memory applications is increasing. At the same time, as photonic-electronic convergence advances, demand for optical module applications in multilayer PCBs for communication infrastructure is also growing. In response to this rapid increase in demand, Mitsui Kinzoku has decided to accelerate its plan for increasing its production capacity beyond what was announced in the news release on August 7. This will enable Mitsui Kinzoku to meet higher-than-anticipated demand without a large amount of additional capital investment.
The Company will contribute to the realization of a sustainable society by implementing its vision for 2030, “Building new businesses －and the future－ with our material intelligence,” based on its purpose, “We promote the well-being of the world through a spirit of exploration and diverse technologies.”
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Mitsui Kinzoku Accelerates Enhancement of MicroThin™ Production Capacity